Invention Grant
- Patent Title: Electronic device packages and methods of manufacturing the same
- Patent Title (中): 电子器件封装及其制造方法
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Application No.: US13718899Application Date: 2012-12-18
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Publication No.: US08816480B2Publication Date: 2014-08-26
- Inventor: Tae Jim Kang
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2012-0076615 20120713
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L29/84 ; H01L23/498
Abstract:
The electronic device package includes a package substrate including a frame portion and a cantilever portion surrounded by the frame portion, at least one semiconductor chip mounted on the cantilever portion, and a molding member disposed on the package substrate to cover the at least one semiconductor chip. The cantilever portion has a first edge connected to the frame portion and declines from the first edge toward a second edge located opposite to the first edge. Related methods are also provided.
Public/Granted literature
- US20140015072A1 ELECTRONIC DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2014-01-16
Information query
IPC分类:
