Invention Grant
- Patent Title: Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages
- Patent Title (中): 包括绝热材料的半导体器件封装以及制造和使用这种半导体封装的方法
-
Application No.: US13547296Application Date: 2012-07-12
-
Publication No.: US08816494B2Publication Date: 2014-08-26
- Inventor: Steven Groothuis , Jian Li , Shijian Luo
- Applicant: Steven Groothuis , Jian Li , Shijian Luo
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/22 ; H01L23/10 ; H01L23/34 ; H01L21/00
Abstract:
Semiconductor device packages comprise a first semiconductor device comprising a heat-generating region located on at least one end thereof. A second semiconductor device is attached to the first semiconductor device. At least a portion of the heat-generating region extends laterally beyond at least one corresponding end of the second semiconductor device. A thermally insulating material at least partially covers the end of the second semiconductor device. Methods of forming a semiconductor device packages comprise attaching a second semiconductor device to a first semiconductor device. The first semiconductor device comprises a heat-generating region at an end thereof. At least a portion of the heat-generating region extends laterally beyond an end of the second semiconductor device. The end of the second semiconductor device is at least partially covered with a thermally insulating material.
Public/Granted literature
Information query
IPC分类:
