Invention Grant
- Patent Title: Structures and formation methods of packages with heat sinks
- Patent Title (中): 具有散热片的封装的结构和形成方法
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Application No.: US13398672Application Date: 2012-02-16
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Publication No.: US08816495B2Publication Date: 2014-08-26
- Inventor: Chung Yu Wang , Shih-Yi Syu , Jing-Cheng Lin
- Applicant: Chung Yu Wang , Shih-Yi Syu , Jing-Cheng Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater and Matsil, L.L.P.
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A device includes a package component, and a die over and bonded to the package component. The die includes a substrate. A heat sink is disposed over and bonded to a back surface of the substrate through direct bonding.
Public/Granted literature
- US20130217188A1 Structures and Formation Methods of Packages with Heat Sinks Public/Granted day:2013-08-22
Information query
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