Invention Grant
- Patent Title: Semiconductor apparatus, substrate design method, and substrate design apparatus
- Patent Title (中): 半导体装置，基板设计方法和基板设计装置
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Application No.: US12567893Application Date: 2009-09-28
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Publication No.: US08816510B2Publication Date: 2014-08-26
- Inventor: Noriyuki Matsui , Hidehisa Sakai
- Applicant: Noriyuki Matsui , Hidehisa Sakai
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2008-252348 20080930
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/498 ; H01L23/367
Abstract:
A semiconductor apparatus including: a substrate; and a semiconductor chip mounted on the substrate, wherein the substrate has plural holes, and the plural holes are provided such that the density on a substrate surface of the holes in a first area, which is an area of the substrate facing a semiconductor chip peripheral portion, is higher than the density on the substrate surface of the holes in an area excluding the first area on the substrate.
Public/Granted literature
- US20100078810A1 SEMICONDUCTOR APPARATUS, SUBSTRATE DESIGN METHOD, AND SUBSTRATE DESIGN APPARATUS Public/Granted day:2010-04-01
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