Invention Grant
US08816514B2 Microelectronic assembly with joined bond elements having lowered inductance
有权
具有接合结合元件的微电子组件具有降低的电感
- Patent Title: Microelectronic assembly with joined bond elements having lowered inductance
- Patent Title (中): 具有接合结合元件的微电子组件具有降低的电感
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Application No.: US13853268Application Date: 2013-03-29
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Publication No.: US08816514B2Publication Date: 2014-08-26
- Inventor: Belgacem Haba , Philip Damberg , Philip R. Osborn
- Applicant: Tessera, Inc.
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: KR10-2010-0040446 20100430
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
First and second bond elements, e.g., wire bonds, electrically connect a chip contact with one or more substrate contacts of a substrate, and can be arranged so that the second bond element is joined to the first bond element at each end and so that the second bond element does not touch the chip contact or one or more substrate contacts. A third bond element can be joined to ends of the first and second bond elements. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact.
Public/Granted literature
- US20130292834A1 MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE Public/Granted day:2013-11-07
Information query
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