Invention Grant
US08816515B2 Semiconductor module having sliding case and manufacturing method thereof
有权
具有滑动壳体的半导体模块及其制造方法
- Patent Title: Semiconductor module having sliding case and manufacturing method thereof
- Patent Title (中): 具有滑动壳体的半导体模块及其制造方法
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Application No.: US13779502Application Date: 2013-02-27
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Publication No.: US08816515B2Publication Date: 2014-08-26
- Inventor: Young Ki Lee , Kwang Soo Kim , Young Hoon Kwak , Sun Woo Yun
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0149148 20121220
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/02 ; H01L23/34 ; H01L23/28 ; H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one electronic element is mounted, at least one external connection terminal fastened to the module substrate, and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other.
Public/Granted literature
- US20140175631A1 SEMICONDUCTOR MODULE HAVING SLIDING CASE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-06-26
Information query
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