Invention Grant
- Patent Title: Eddy current array configuration with reduced length and thickness
- Patent Title (中): 具有减小长度和厚度的涡流阵列配置
-
Application No.: US13974422Application Date: 2013-08-23
-
Publication No.: US08816680B2Publication Date: 2014-08-26
- Inventor: Benoit LePage
- Applicant: Olympus NDT Inc.
- Applicant Address: US MA Waltham
- Assignee: Olympus NDT Inc.
- Current Assignee: Olympus NDT Inc.
- Current Assignee Address: US MA Waltham
- Agency: Ostrolenk Faber LLP
- Main IPC: G01N27/72
- IPC: G01N27/72 ; G01R33/12

Abstract:
The invention herein disclosed provides a 2D coil and a method of using the 2D wound EC sensor for reproducing the Eddy Current Testing (ECT) response of a prior art 3D orthogonal sensor. The resulting thin-film eddy current array of coils configured to be placed parallel and against the test surface, and a corresponding eddy current circuitry operable to excite and receive eddy current from the array of coils. The array of coils forming at least a first inspection channel and a second inspection channel. The eddy current circuitry is configured and operable in a way that the one of the first pair of driver coils is usable as one of the second pair of driver coils; and one of the first pair of receiver coils is useable as one the second pair of receiver coils.
Public/Granted literature
- US20140002072A1 EDDY CURRENT ARRAY CONFIGURATION WITH REDUCED LENGTH AND THICKNESS Public/Granted day:2014-01-02
Information query