Invention Grant
- Patent Title: Electrical probe assembly
- Patent Title (中): 电探头组件
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Application No.: US12547561Application Date: 2009-08-26
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Publication No.: US08816711B2Publication Date: 2014-08-26
- Inventor: David R. Lyders , George Alan Salisbury
- Applicant: David R. Lyders , George Alan Salisbury
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Hartford
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: G01R1/067
- IPC: G01R1/067 ; H01Q1/36 ; H01J49/40 ; H05K1/11 ; H01R24/58 ; H01R107/00 ; H05K1/14
Abstract:
An electrical probe assembly includes a flexible circuit. A plurality of electrically conductive regions is on a first side of the flexible circuit. The flexible circuit is arranged about an axis formed by rolling the flexible circuit such that the electrically conductive regions form a plurality of isolated electrically conductive bands.
Public/Granted literature
- US20110047789A1 ELECTRICAL PROBE ASSEMBLY Public/Granted day:2011-03-03
Information query
