Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
-
Application No.: US12765469Application Date: 2010-04-22
-
Publication No.: US08816739B2Publication Date: 2014-08-26
- Inventor: Taiki Uemura , Yoshiharu Tosaka
- Applicant: Taiki Uemura , Yoshiharu Tosaka
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H03K3/356
- IPC: H03K3/356 ; H03K3/3562
Abstract:
There is provided a semiconductor device having: a latch circuit (103, 104) having a plurality of data holding nodes; a first capacitance element (C) connected to the first data holding node (A) included in the plurality of data holding nodes; and a first switch element (SW2) provided between the first data holding node (A) and the first capacitance element (C).
Public/Granted literature
- US20100213998A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-08-26
Information query
IPC分类:
