Invention Grant
- Patent Title: High power, low-passive intermodulation microwave termination
- Patent Title (中): 高功率,低有源互调微波终端
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Application No.: US12688311Application Date: 2010-01-15
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Publication No.: US08816792B2Publication Date: 2014-08-26
- Inventor: Marek E. Antkowiak , Carl Schraufnagl
- Applicant: Marek E. Antkowiak , Carl Schraufnagl
- Applicant Address: US NJ East Hanover
- Assignee: R & D Microwaves LLC
- Current Assignee: R & D Microwaves LLC
- Current Assignee Address: US NJ East Hanover
- Agency: Stroock & Stroock & Lavan LLP
- Main IPC: H01P1/26
- IPC: H01P1/26

Abstract:
A termination configured to absorb high microwave power while generating low levels of passive intermodulation interference. The termination includes a microwave cable having a first end and a second end providing an insertion loss from the first end to the second end, a heat-dispersive element in thermal contact with at least a portion of the microwave cable, a channel accommodating the microwave cable, and an input connector coupled to the proximal end of the microwave cable. Optionally, one or more plates having grooves to accommodate the microwave cable may be provided between the heat-dispersive elements.
Public/Granted literature
- US20110175690A1 HIGH POWER, LOW-PASSIVE INTERMODULATION MICROWAVE TERMINATION Public/Granted day:2011-07-21
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