Invention Grant
- Patent Title: Simultaneous multi-spot inspection and imaging
- Patent Title (中): 同时多点检查和成像
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Application No.: US12362191Application Date: 2009-01-29
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Publication No.: US08817248B2Publication Date: 2014-08-26
- Inventor: Mehdi Vaez-Iravani , Lawrence Robert Miller
- Applicant: Mehdi Vaez-Iravani , Lawrence Robert Miller
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Davis Wright Tremaine LLP
- Main IPC: G01N21/00
- IPC: G01N21/00

Abstract:
A compact and versatile multi-spot inspection imaging system employs an objective for focusing an array of radiation beams to a surface and a second reflective or refractive objective having a large numerical aperture for collecting scattered radiation from the array of illuminated spots. The scattered radiation from each illuminated spot is focused to a corresponding receiver or detector so that information about a scattering may be conveyed to a corresponding detector in a remote detector array for processing. Radiation reflected from the spots is imaged into a first array of receivers or detectors so that each receiver in the first array receives radiation from a corresponding spot in the array of spots; and scattered radiation from the spots is imaged onto a second array of receivers or detectors in a dark field imaging scheme so that each receiver or detector in the second array receives radiation from a corresponding spot.
Public/Granted literature
- US20090161096A1 Simultaneous Multi-Spot Inspection And Imaging Public/Granted day:2009-06-25
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