Disclosed herein is a method of manufacturing a stacked resonant coil, the method including: (A) forming circuit layers on a plurality of double-sided FCCLs, respectively, and then stacking the double-sided FCCLs respectively having the circuit layers formed thereon; (B) forming first and second conductive via holes in the stacked plurality of double-sided FCCLs, the first conductive via hole being for interlayer connection of the first ends respectively formed in the circuit layers and the second conductive via hole being for interlayer connection of the first electrode patterns respectively formed in the circuit layers; and (C) forming a wiring layer on an external layer of an uppermost double-sided FCCL in the staked plurality of double-sided FCCLs, the wiring layer electrically connecting the first ends and the first electrode patterns, thereby improving mass-productivity of products having uniform performances and excellent quality.