A component mounting method for mounting a plurality of types of components on a substrate is disclosed. The mounting method includes providing a component mounting apparatus 1 for mounting a semiconductor chip 6a picked from a component feeding stage 3 to a substrate 7, having a paste coating unit 20 for squirting paste from an associated coating nozzle to apply the paste to the substrate 7, a paste transfer unit 54 for transferring paste by an associated transfer tool to the substrate 7, and a heating-press unit 57 for pressing the component loaded on the substrate 7 against the substrate 7 while heating the component. The mounting method also includes selecting a work unit from the paste coating unit 20, the paste transfer unit 54 and the heating-press unit 57, and equipping a second head 12 with the selected work unit.