Invention Grant
- Patent Title: Method for producing liquid-ejecting head
- Patent Title (中): 液体喷射头的制造方法
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Application No.: US13079287Application Date: 2011-04-04
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Publication No.: US08819935B2Publication Date: 2014-09-02
- Inventor: Seiichi Fujita , Yutaka Yamazaki
- Applicant: Seiichi Fujita , Yutaka Yamazaki
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2010-137994 20100617
- Main IPC: B21D53/76
- IPC: B21D53/76 ; B23P17/00 ; B41J2/05 ; B41J2/16 ; B41J2/14

Abstract:
A method for producing a liquid-ejecting head including a passage-forming substrate and a protective substrate. The passage-forming substrate has pressure-generating chambers communicating with nozzle orifices, piezoelectric devices that change the inner pressures of the pressure-generating chambers, and liquid supply channels for supplying the pressure-generating chambers. The protective substrate has a piezoelectric-device accommodating portion and a through-hole, through which wirings to lead electrodes extended from the piezoelectric devices pass thorough. The method includes forming the piezoelectric-device accommodating portion and a portion of the through-hole in the protective substrate while leaving a lid, a portion of the protective substrate, closing off an opening of the through-hole, bonding the protective substrate to the passage-forming substrate, forming the pressure-generating chambers and the liquid supply channels in the passage-forming substrate, forming a protective film on surfaces of the passage-forming substrate and the protective substrate, and removing the lid to complete the formation of the through-hole.
Public/Granted literature
- US20110308715A1 METHOD FOR PRODUCING LIQUID-EJECTING HEAD Public/Granted day:2011-12-22
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