Invention Grant
- Patent Title: Shot peening apparatus
- Patent Title (中): 喷丸硬化设备
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Application No.: US13512404Application Date: 2010-11-02
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Publication No.: US08820131B2Publication Date: 2014-09-02
- Inventor: Jun Fujita
- Applicant: Jun Fujita
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Heavy Industries, Ltd.
- Current Assignee: Mitsubishi Heavy Industries, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2009-288310 20091218
- International Application: PCT/JP2010/069502 WO 20101102
- International Announcement: WO2011/074340 WO 20110623
- Main IPC: C21D7/06
- IPC: C21D7/06 ; C21D10/00

Abstract:
To correspond to a shape of a shot-peening worked portion and to prevent a situation where shot media scatter around the worked portion. To achieve this object, a shot peening apparatus for hitting shot media B against a welded part W and for applying a compressive stress to the welded part includes a kinetic-energy applying unit 26 that applies kinetic energy to the shot media B by an oscillator 26b, and a surrounding unit that surrounds both a worked portion U including the welded part W and surroundings of the oscillator 26b, and that confines the shot media B within the surrounded region while changing a state to correspond to a shape of the worked portion U.
Public/Granted literature
- US20120227454A1 SHOT PEENING APPARATUS Public/Granted day:2012-09-13
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