The present invention provides a module packaging device, which includes a cushioning device and a plurality of retention boards mounted to the cushioning device. The cushioning device includes a plurality of interconnected cushioning air columns of which every two adjacent ones of the cushioning air columns form a receiving channel. The retention boards are respectively mounted in the receiving channels. Modules are each positioned on each of the cushioning air columns between two of the retention boards. The module packaging device uses a cushioning device that is composed of cushioning air columns and the cushioning device, which is of a U-shaped, is positioned in a package box to provide an effect of cushioning and protection to opposite ends and bottom of the liquid crystal modules or the backlight modules received therein to protect the liquid crystal modules or the backlight modules from damages caused by external forces.