Invention Grant
- Patent Title: Spacecraft heat dissipation system
- Patent Title (中): 航天器散热系统
-
Application No.: US12730457Application Date: 2010-03-24
-
Publication No.: US08820684B2Publication Date: 2014-09-02
- Inventor: Douglas V. McKinnon , Timothy P. Moran
- Applicant: Douglas V. McKinnon , Timothy P. Moran
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: McDermott Will & Emery LLP
- Main IPC: B64G1/52
- IPC: B64G1/52 ; B64G1/50

Abstract:
A spacecraft is provided. The spacecraft comprises a plurality of heat generating electrical components. A first thermal radiator panel and a second thermal radiator panel are provided on the spacecraft, each panel being thermally coupled to the heat generating electrical components. Heat pipes are also provided. At least one first heat pipe is externally attached to the first thermal radiator panel and at least one second heat pipe is externally attached to the second thermal radiator panel. The at least one first heat pipe is thermally coupled to the at least one second heat pipe.
Public/Granted literature
- US20100243817A1 SPACECRAFT HEAT DISSIPATION SYSTEM Public/Granted day:2010-09-30
Information query