Invention Grant
- Patent Title: Mold for manufacturing an I/O port of a computer front panel
- Patent Title (中): 用于制造计算机前面板的I / O端口的模具
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Application No.: US13662628Application Date: 2012-10-29
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Publication No.: US08821146B2Publication Date: 2014-09-02
- Inventor: Xiao-Lin Zhang , Ming-Hui Luo , Hui-Min Zhou
- Applicant: Xiao-Lin Zhang , Ming-Hui Luo , Hui-Min Zhou
- Applicant Address: CN Wuhan TW New Taipei
- Assignee: Hong Fu Jin Precision Indusrty (WuHan) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Indusrty (WuHan) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Wuhan TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201210095534 20120402
- Main IPC: B29C45/10
- IPC: B29C45/10

Abstract:
A mold includes a mold core, a first cover, and a second cover. The mold core includes a cavity and a pair of elastic pieces. The pair of elastic pieces is in the cavity and divides the cavity into a first room and a second room. The first cover covers the first room of the cavity. The first cover defines a plurality of first plug holes. A first I/O can be formed in the first room by injecting a first liquid plastic material in the first room via the plurality of first plug holes. The second cover covers the first room and second room of the cavity. The second cover defines a plurality of second plug holes. A second I/O port assembly can be formed by injecting a second liquid plastic material in the first room and the second room via the plurality of second plug holes.
Public/Granted literature
- US20130259971A1 MOLD FOR MANUFACTURING I/O PORT OF COMPUTER FRONT PANEL Public/Granted day:2013-10-03
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