Invention Grant
- Patent Title: Clamp mechanism for clamping a cable
- Patent Title (中): 夹紧电缆的夹紧机构
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Application No.: US13607837Application Date: 2012-09-10
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Publication No.: US08821179B2Publication Date: 2014-09-02
- Inventor: Chun-Fei Yang
- Applicant: Chun-Fei Yang
- Applicant Address: TW Hsichih, New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW Hsichih, New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: TW100147721A 20111221
- Main IPC: H01R4/50
- IPC: H01R4/50 ; H01R13/625
Abstract:
A clamp mechanism for clamping a cable on a circuit board is disclosed in the present invention. The clamp mechanism includes a base disposed on the circuit board. The cable can be accommodated inside the base. The clamp mechanism further includes a clamping portion disposed on the base in a resiliently deformable manner. The clamping portion moves away from the circuit board when the cable is accommodated inside the base, and a resilient recovering force generated by the resilient deformation simultaneously drives the clamping portion to press the cable, so as to constrain a movement of the cable relative to the base.
Public/Granted literature
- US20130164964A1 CLAMP MECHANISM Public/Granted day:2013-06-27
Information query
