Invention Grant
- Patent Title: Surface mounted electrical contact
- Patent Title (中): 表面电气接触
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Application No.: US13420251Application Date: 2012-03-14
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Publication No.: US08821198B2Publication Date: 2014-09-02
- Inventor: Yohei Harada
- Applicant: Yohei Harada
- Applicant Address: JP Kanagawa-ken
- Assignee: Tyco Electronics Japan G.K.
- Current Assignee: Tyco Electronics Japan G.K.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Barley Snyder
- Priority: JP2009-211645 20090914
- Main IPC: H01R4/48
- IPC: H01R4/48

Abstract:
An electrical contact is provided for electrically connecting a connecting object to a printed circuit board, without the need of a housing. The electrical contact a board mounting portion, a spring region, and a contact portion. The board mounting portion extends parallel to the major surface of the printed circuit board with one end mounted thereto. The spring region extends from another end of the board mounting portion and having a holding portion that extends parallel to the major surface of the printed circuit board and an inclined portion that extends vertically from the holding portion and with respect to the printed circuit board. The contact portion connects to the inclined portion of the spring region and includes a curved shape with a connecting object contact point at a top of a curved part.
Public/Granted literature
- US20120171909A1 Electrical Contact Public/Granted day:2012-07-05
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