Invention Grant
US08821641B2 Nozzle unit, and apparatus and method for treating substrate with the same
有权
喷嘴单元，以及用于处理基板的设备和方法
- Patent Title: Nozzle unit, and apparatus and method for treating substrate with the same
- Patent Title (中): 喷嘴单元，以及用于处理基板的设备和方法
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Application No.: US13606774Application Date: 2012-09-07
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Publication No.: US08821641B2Publication Date: 2014-09-02
- Inventor: Sang Gon Lee , Hyeong Soo Park
- Applicant: Sang Gon Lee , Hyeong Soo Park
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce
- Priority: KR10-2011-0099942 20110930; KR10-2011-0121056 20111118
- Main IPC: B05B1/28
- IPC: B05B1/28 ; C23C16/455 ; C23C16/458 ; H01L21/687
Abstract:
Provided is a substrate treatment apparatus. The substrate treatment apparatus includes a process chamber, a support unit disposed within the process chamber to support a substrate, and a nozzle unit disposed within the process chamber to spray gas. The nozzle unit includes a first nozzle spraying process gas, and a second nozzle spraying blocking gas onto an inner wall of the process chamber or an area adjacent to the support unit to prevent the process gas from being deposited on the inner wall of the process chamber or the support unit.
Public/Granted literature
- US20130084391A1 NOZZLE UNIT, AND APPARATUS AND METHOD FOR TREATING SUBSTRATE WITH THE SAME Public/Granted day:2013-04-04
Information query
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