Invention Grant
US08821644B2 Bevel/backside polymer removing method and device, substrate processing apparatus and storage medium
有权
斜面/背面聚合物去除方法和装置,基板处理装置和存储介质
- Patent Title: Bevel/backside polymer removing method and device, substrate processing apparatus and storage medium
- Patent Title (中): 斜面/背面聚合物去除方法和装置,基板处理装置和存储介质
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Application No.: US12268649Application Date: 2008-11-11
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Publication No.: US08821644B2Publication Date: 2014-09-02
- Inventor: Isamu Sakuragi , Akinori Kitamura , Tsutomu Hiroki , Takehiro Shindo
- Applicant: Isamu Sakuragi , Akinori Kitamura , Tsutomu Hiroki , Takehiro Shindo
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2007-294529 20071113
- Main IPC: B08B1/00
- IPC: B08B1/00 ; B24B37/34 ; H01L21/02 ; H01L21/67

Abstract:
A bevel/backside polymer removing method removes multi-layered bevel/backside polymers adhering to a bevel surface and a backside of a target substrate. The multi-layered bevel/backside polymers include an inorganic layer and an organic layer. The bevel/backside polymer removing method includes mechanically destroying the multi-layered bevel/backside polymers and heating residues of the multi-layered bevel/backside polymers mechanically destroyed.
Public/Granted literature
- US20090143894A1 BEVEL/BACKSIDE POLYMER REMOVING METHOD AND DEVICE, SUBSTRATE PROCESSING APPARATUS AND STORAGE MEDIUM Public/Granted day:2009-06-04
Information query
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