Invention Grant
US08821644B2 Bevel/backside polymer removing method and device, substrate processing apparatus and storage medium 有权
斜面/背面聚合物去除方法和装置,基板处理装置和存储介质

Bevel/backside polymer removing method and device, substrate processing apparatus and storage medium
Abstract:
A bevel/backside polymer removing method removes multi-layered bevel/backside polymers adhering to a bevel surface and a backside of a target substrate. The multi-layered bevel/backside polymers include an inorganic layer and an organic layer. The bevel/backside polymer removing method includes mechanically destroying the multi-layered bevel/backside polymers and heating residues of the multi-layered bevel/backside polymers mechanically destroyed.
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