Invention Grant
- Patent Title: Sensor substrate and method of fabricating same
- Patent Title (中): 传感器基板及其制造方法
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Application No.: US11924402Application Date: 2007-10-25
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Publication No.: US08821793B2Publication Date: 2014-09-02
- Inventor: Shaun Pendo , Rajiv Shah , Edward Chernoff
- Applicant: Shaun Pendo , Rajiv Shah , Edward Chernoff
- Applicant Address: US CA Northridge
- Assignee: Medtronic MiniMed, Inc.
- Current Assignee: Medtronic MiniMed, Inc.
- Current Assignee Address: US CA Northridge
- Agency: Foley & Lardner LLP
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/18 ; H05K3/28 ; H05K3/40 ; H05K1/03 ; A61B5/00

Abstract:
A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
Public/Granted literature
- US20080050281A1 SENSOR SUBSTRATE AND METHOD OF FABRICATING SAME Public/Granted day:2008-02-28
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