Invention Grant
- Patent Title: Sensor chip and method of manufacturing the same
- Patent Title (中): 传感器芯片及其制造方法
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Application No.: US12934827Application Date: 2009-03-19
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Publication No.: US08821794B2Publication Date: 2014-09-02
- Inventor: Evelyne Gridelet , Franciscus Widdershoven , Pablo Garcia Tello , Magali Lambert
- Applicant: Evelyne Gridelet , Franciscus Widdershoven , Pablo Garcia Tello , Magali Lambert
- Applicant Address: NL Eindhoven
- Assignee: NXP, B.V.
- Current Assignee: NXP, B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP08103203 20080331
- International Application: PCT/IB2009/051156 WO 20090319
- International Announcement: WO2009/122314 WO 20091008
- Main IPC: G01N27/00
- IPC: G01N27/00 ; G01N33/543 ; G01N27/22
Abstract:
A sensor chip (100) for detecting particles, the sensor chip (100) comprising a substrate (102), an electric connection structure (104) arranged in a surface portion of the substrate (102) and adapted for an electric connection to an electric connection element (106), a sensor active region (108) arranged in another surface portion of the substrate (102) and being sensitive to the presence of the particles to be detected, and a continuous dielectric layer (110) covering the substrate (102) including covering the electric connection structure (104) and the sensor active region (108).
Public/Granted literature
- US20110027128A1 SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-02-03
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