Invention Grant
- Patent Title: Method for modification of the surface and subsurface regions of metallic substrates
- Patent Title (中): 修改金属基材表面和表面下区域的方法
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Application No.: US13632348Application Date: 2012-10-01
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Publication No.: US08821988B2Publication Date: 2014-09-02
- Inventor: Atul Gokhale
- Applicant: Dayton T. Brown, Inc.
- Applicant Address: US NY Bohemia
- Assignee: Dayton T. Brown, Inc.
- Current Assignee: Dayton T. Brown, Inc.
- Current Assignee Address: US NY Bohemia
- Agency: Collard & Roe, P.C.
- Main IPC: H05B6/02
- IPC: H05B6/02 ; H05B6/06 ; B05D7/14

Abstract:
A method for surface engineering a metal substrate involves mixing precursor powders with a polymer binder to create a coating mix and coating the substrate with the coating mix. The substrate is then heated via induction heating, with the frequency and duration of the heating being controlled so as to cause a reaction of the precursor powders to create one or more types of ceramics or intermetallics, evaporate the polymer binder, melt a portion of the substrate, and cause the synthesized compounds to mix with the substrate and form a compositionally graded surface modification. The compound(s) created by the reactions are mixed with molten portion of the substrate and upon re-solidification of the substrate, are distributed at decreasing percentages along a depth of the substrate so that their content varies from 100% at a surface of the substrate to 0% at a defined depth of the substrate.
Public/Granted literature
- US20140093653A1 METHOD FOR MODIFICATION OF THE SURFACE AND SUBSURFACE REGIONS OF METALLIC SUBSTRATES Public/Granted day:2014-04-03
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