Invention Grant
- Patent Title: Element for electronic component
- Patent Title (中): 电子元件元件
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Application No.: US12866191Application Date: 2009-02-05
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Publication No.: US08822010B2Publication Date: 2014-09-02
- Inventor: Kazumi Naito , Yuji Osawa , Toshio Nagashima , Masakazu Kobayashi
- Applicant: Kazumi Naito , Yuji Osawa , Toshio Nagashima , Masakazu Kobayashi
- Applicant Address: JP Tokyo
- Assignee: Showa Denko K.K.
- Current Assignee: Showa Denko K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-025770 20080205
- International Application: PCT/JP2009/051937 WO 20090205
- International Announcement: WO2009/099127 WO 20090813
- Main IPC: H01L51/30
- IPC: H01L51/30 ; B05D3/14 ; H01G9/04 ; H01G11/48 ; H01G9/028 ; H01G9/00 ; H01G11/56

Abstract:
A surface of an anode body made of a metal material having a valve action is oxidized so as to form a dielectric layer, a conductive polymer precursor solution is stuck to the surface of the dielectric layer, the solvent is evaporated in an atmosphere of a relative humidity of 30 to 45% to be removed, electropolymerization is carried out so as to obtain a semiconductor layer having projections being 2 to 70 μm high on the outer surface thereof, a conductive carbon layer is laminated using a conductive carbon paste, and a conductive metal layer containing a metal conductive powder and a binder is laminated so as to obtain an element for an electronic component, and the element for an electronic component is encapsulated by a resin so as to obtain an electronic component.
Public/Granted literature
- US20110017982A1 ELEMENT FOR ELECTRONIC COMPONENT Public/Granted day:2011-01-27
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