Invention Grant
- Patent Title: Hot melt moisture cure adhesive composition
- Patent Title (中): 热熔水湿固化胶粘剂组成
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Application No.: US13468628Application Date: 2012-05-10
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Publication No.: US08822031B2Publication Date: 2014-09-02
- Inventor: Marietta B. Helmeke , Jeffrey G. Schmierer , Theresa Unze-Schmierer
- Applicant: Marietta B. Helmeke , Jeffrey G. Schmierer , Theresa Unze-Schmierer
- Applicant Address: US MN St. Paul
- Assignee: H.B. Fuller Company
- Current Assignee: H.B. Fuller Company
- Current Assignee Address: US MN St. Paul
- Main IPC: B32B27/40
- IPC: B32B27/40 ; C09J175/04 ; C08L75/04

Abstract:
An adhesive composition that includes: one or more polyester polyether copolymers of formula I: wherein Nu is a predominately cyclic nucleus and R1 is randomly selected from either a C2-6 alkylene or an amorphous, long-chain polyether subunit including a polyoxyalkylene group; one or more polyisocyanate prepolymers that includes the reaction product of: one or more polyols; and a polyfunctional isocyanate having a functionality of more than about 2; polymeric MDI; and a first aromatic or aromatic-aliphatic polymer tackifying resin having a softening point of equal to or greater than about 100° C.
Public/Granted literature
- US20120288720A1 Hot Melt Moisture Cure Adhesive Composition Public/Granted day:2012-11-15
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