Invention Grant
- Patent Title: Paste composition and printed circuit board
- Patent Title (中): 糊状组合物和印刷电路板
-
Application No.: US13356955Application Date: 2012-01-24
-
Publication No.: US08822048B2Publication Date: 2014-09-02
- Inventor: Hirofumi Ebe , Shinichi Inoue , Yoshihiro Furukawa
- Applicant: Hirofumi Ebe , Shinichi Inoue , Yoshihiro Furukawa
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2011-014129 20110126
- Main IPC: H01M2/02
- IPC: H01M2/02 ; H01M14/00 ; H05K5/03 ; B32B33/00

Abstract:
A conductor layer is formed on one surface of a base insulating layer. The conductor layer includes a collector portion, and a drawn-out conductor portion extending in an elongated shape from the collector portion. A cover layer is formed on the base insulating layer to cover a predetermined portion of the conductor layer. A material for the cover layer includes a paste composition containing a compound expressed by the formula (1).
Public/Granted literature
- US20120186865A1 PASTE COMPOSITION AND PRINTED CIRCUIT BOARD Public/Granted day:2012-07-26
Information query