Invention Grant
US08822103B2 Mask blank, transfer mask, method of manufacturing a transfer mask, and method of manufacturing a semiconductor device
有权
掩模毛坯,转印掩模,制造转印掩模的方法以及制造半导体器件的方法
- Patent Title: Mask blank, transfer mask, method of manufacturing a transfer mask, and method of manufacturing a semiconductor device
- Patent Title (中): 掩模毛坯,转印掩模,制造转印掩模的方法以及制造半导体器件的方法
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Application No.: US13288365Application Date: 2011-11-03
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Publication No.: US08822103B2Publication Date: 2014-09-02
- Inventor: Atsushi Kominato , Osamu Nozawa , Hiroyuki Iwashita , Masahiro Hashimoto
- Applicant: Atsushi Kominato , Osamu Nozawa , Hiroyuki Iwashita , Masahiro Hashimoto
- Applicant Address: JP Tokyo
- Assignee: Hoya Corporation
- Current Assignee: Hoya Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-247986 20101105
- Main IPC: G03F1/50
- IPC: G03F1/50 ; G03F1/58 ; G03F1/74 ; G03F7/20

Abstract:
A mask blank for manufacturing a transfer mask adapted to be applied with ArF excimer laser exposure light that has a transparent substrate and a light-shielding film formed into a transfer pattern. The light-shielding film has at least two-layers, one a lower layer composed mainly of a first material containing a transition metal, silicon, and nitrogen, and the other an upper layer composed mainly of a second material containing a transition metal, silicon, and nitrogen. A ratio of a first etching rate of the lower layer to a second etching rate of the upper layer is 1.0 or more and 5.0 or less in etching carried out by supplying a fluorine-containing substance onto a target portion and irradiating charged particles to the target portion. Another ratio satisfies the following formula CN≧−0.00526CMo2−0.640CMo=26.624.
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