Invention Grant
- Patent Title: Patterning process and resist composition
- Patent Title (中): 图案化过程和抗蚀剂组成
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Application No.: US13661267Application Date: 2012-10-26
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Publication No.: US08822136B2Publication Date: 2014-09-02
- Inventor: Jun Hatakeyama , Kazuhiro Katayama , Youichi Ohsawa
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2011-235987 20111027
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039 ; G03F7/20 ; G03F7/30 ; G03F7/38

Abstract:
A negative pattern is formed by coating a resist composition onto a substrate, the resist composition comprising a polymer comprising recurring units having an acid labile group-substituted hydroxyl group, an acid generator, an onium salt of perfluoroalkyl ether carboxylic acid, and an organic solvent, prebaking, exposing, baking, and developing in an organic solvent such that the unexposed region of film is dissolved away and the exposed region of film is not dissolved. In image formation via positive/negative reversal by organic solvent development, the resist film is characterized by a high dissolution contrast between the unexposed and exposed regions.
Public/Granted literature
- US20130108960A1 PATTERNING PROCESS AND RESIST COMPOSITION Public/Granted day:2013-05-02
Information query
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