Invention Grant
- Patent Title: Packaged semiconductor light emitting devices having multiple optical elements and methods of forming the same
- Patent Title (中): 具有多个光学元件的封装半导体发光器件及其形成方法
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Application No.: US13486223Application Date: 2012-06-01
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Publication No.: US08822245B2Publication Date: 2014-09-02
- Inventor: Nicholas W. Medendorp, Jr.
- Applicant: Nicholas W. Medendorp, Jr.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B29C43/02 ; B29C43/18 ; B29L11/00 ; H01L33/52
Abstract:
Methods of packaging a semiconductor light emitting device include providing a substrate having the semiconductor light emitting device on a front face thereof. A first optical element is formed from a first material on the front face proximate the semiconductor light emitting device but not covering the semiconductor light emitting device and a second optical element is formed from a second material, different from the first material, over the semiconductor light emitting device and the first optical element. Packaged semiconductor light emitting devices are also provided.
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