Invention Grant
- Patent Title: MEMS device and manufacturing method
- Patent Title (中): MEMS器件及制造方法
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Application No.: US13312503Application Date: 2011-12-06
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Publication No.: US08822254B2Publication Date: 2014-09-02
- Inventor: Jozef Thomas Martinus Van Beek , Klaus Reimann , Remco Henricus Wilhelmus Pijnenburg , Twan Van Lippen
- Applicant: Jozef Thomas Martinus Van Beek , Klaus Reimann , Remco Henricus Wilhelmus Pijnenburg , Twan Van Lippen
- Applicant Address: NL Eindhoven
- Assignee: NXP, B.V.
- Current Assignee: NXP, B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP10193851 20101206
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/84
Abstract:
A MEMS manufacturing method and device in which a spacer layer is provided over a side wall of at least one opening in a structural layer which will define the movable MEMS element. The opening extends below the structural layer. The spacer layer forms a side wall portion over the side wall of the at least one opening and also extends below the level of the structural layer to form a contact area.
Public/Granted literature
- US20120139065A1 MEMS DEVICE AND MANUFACTURING METHOD Public/Granted day:2012-06-07
Information query
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