Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13356044Application Date: 2012-01-23
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Publication No.: US08822264B2Publication Date: 2014-09-02
- Inventor: Shunpei Yamazaki , Kengo Akimoto
- Applicant: Shunpei Yamazaki , Kengo Akimoto
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2008-224034 20080901
- Main IPC: H01L21/34
- IPC: H01L21/34 ; H01L21/469 ; H01L21/336

Abstract:
An object is to provide favorable interface characteristics of a thin film transistor including an oxide semiconductor layer without mixing of an impurity such as moisture. Another object is to provide a semiconductor device including a thin film transistor having excellent electric characteristics and high reliability, and a method by which a semiconductor device can be manufactured with high productivity. A main point is to perform oxygen radical treatment on a surface of a gate insulating layer. Accordingly, there is a peak of the oxygen concentration at an interface between the gate insulating layer and a semiconductor layer, and the oxygen concentration of the gate insulating layer has a concentration gradient. The oxygen concentration is increased toward the interface between the gate insulating layer and the semiconductor layer.
Public/Granted literature
- US20120122277A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE Public/Granted day:2012-05-17
Information query
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