Invention Grant
- Patent Title: Configurable passive components
- Patent Title (中): 可配置的无源组件
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Application No.: US13553496Application Date: 2012-07-19
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Publication No.: US08822270B2Publication Date: 2014-09-02
- Inventor: Julius Andrew Kovats
- Applicant: Julius Andrew Kovats
- Applicant Address: US CA San Jose
- Assignee: Atmel Corporation
- Current Assignee: Atmel Corporation
- Current Assignee Address: US CA San Jose
- Agency: Fish & Richardson P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A wafer of passive components is diced to leave a flat passive chip. The flat passive chip has bond pads for passive components on a same side of the flat passive chip. The flat passive chip is stacked onto an active chip. The passive components are wirebonded together to connect the passive components in series or parallel, resulting in the flat passive chip having an overall passive characteristic equal to a target characteristic.
Public/Granted literature
- US20140021582A1 CONFIGURABLE PASSIVE COMPONENTS Public/Granted day:2014-01-23
Information query
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