Invention Grant
- Patent Title: Method and apparatus for manufacturing chip package
- Patent Title (中): 制造芯片封装的方法和装置
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Application No.: US13846640Application Date: 2013-03-18
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Publication No.: US08822271B2Publication Date: 2014-09-02
- Inventor: Cheol Ho Joh
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2012-0147856 20121217
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/02 ; H01L21/50
Abstract:
There are proposed a method and apparatus for manufacturing a chip package in which bonding wires are coupled with contact pads in which an overhang holder holds and fixes portions of a surface adjacent to portions where the contact pads are located.
Public/Granted literature
- US20140170812A1 METHOD AND APPARATUS FOR MANUFACTURING CHIP PACKAGE Public/Granted day:2014-06-19
Information query
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