Invention Grant
- Patent Title: Method, apparatus for holding and treatment of a substrate
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Application No.: US13774827Application Date: 2013-02-22
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Publication No.: US08822310B2Publication Date: 2014-09-02
- Inventor: Gerald Lackner , Christian Maier , Francisco Javier Santos Rodriguez
- Applicant: Infineon Technologies AG
- Applicant Address: DE
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: DE102006042026 20060907
- Main IPC: H01L21/46
- IPC: H01L21/46

Abstract:
Some embodiments discussed relates to an apparatus for holding a substrate, comprising a body with a surface for a semiconductor wafer to rest on, with the surface having a first surface area on which a first area of the semiconductor wafer can rest, and a second surface area on which a second area of the semiconductor wafer can rest, wherein the second surface area protrudes with respect to the first surface area.
Public/Granted literature
- US20130164939A1 METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE Public/Granted day:2013-06-27
Information query
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