Invention Grant
- Patent Title: Binder composition for self-curing mold formation
- Patent Title (中): 用于自固化模具成型的粘合剂组合物
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Application No.: US13519078Application Date: 2010-12-17
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Publication No.: US08822568B2Publication Date: 2014-09-02
- Inventor: Masayuki Kato , Toshiki Matsuo , Tomofumi Kanzawa , Takashi Joke
- Applicant: Masayuki Kato , Toshiki Matsuo , Tomofumi Kanzawa , Takashi Joke
- Applicant Address: JP Tokyo
- Assignee: Kao Corporation
- Current Assignee: Kao Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-295711 20091225
- International Application: PCT/JP2010/072779 WO 20101217
- International Announcement: WO2011/078082 WO 20110630
- Main IPC: B22C1/00
- IPC: B22C1/00 ; B22C1/22 ; C08L71/14 ; C09J161/00

Abstract:
A binder composition for self-curing mold formation, comprising at least one condensate (A) selected from furfuryl alcohol condensate and furfuryl alcohol/formaldehyde condensate, and an acid-curable resin (B), wherein about the condensate(s) (A), the presence ratio by mole of its/their furan rings (a) to the total of its/their methylol groups (b), methylene groups (c) and oxymethylene groups (d), a:(b+c+d), is from 1:1.00 to 1:1.08, and the content by percentage of the at least one condensate (A) is from 0.3 to 8.0% by weight.
Public/Granted literature
- US20120289651A1 BINDER COMPOSITION FOR SELF-CURING MOLD FORMATION Public/Granted day:2012-11-15
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