Invention Grant
- Patent Title: Method of preparing a heat-resistant polyamide
- Patent Title (中): 制备耐热聚酰胺的方法
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Application No.: US13263620Application Date: 2009-04-10
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Publication No.: US08822629B2Publication Date: 2014-09-02
- Inventor: Dong-June Hwang , Jae-Bong Lim , Seung-Do Leem , Tae-Young Kim , Sung-su Bae
- Applicant: Dong-June Hwang , Jae-Bong Lim , Seung-Do Leem , Tae-Young Kim , Sung-su Bae
- Applicant Address: KR
- Assignee: SK Chemicals Co., Ltd.
- Current Assignee: SK Chemicals Co., Ltd.
- Current Assignee Address: KR
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/KR2009/001857 WO 20090410
- International Announcement: WO2010/117098 WO 20101014
- Main IPC: C08G69/26
- IPC: C08G69/26
Abstract:
The present invention relates to a method of prepairing a heat-resistant polyamide by carrying out condensation polymerization with a monomer mixture including a diester compound and a diamine compound. The present invention provides an economical method of prepairing a heat-resistant polyamide in that a monomer, a raw material, is simply and chiefly prepared, and the polymerizing reaction time is short because it does not need solvent separately.
Public/Granted literature
- US20120029163A1 METHOD OF PREPARING A HEAT-RESISTANT POLYAMIDE Public/Granted day:2012-02-02
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