Invention Grant
US08822832B2 Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit board
有权
用于印刷电路板，绝缘膜，预浸料和多层印刷电路板的环氧树脂组合物
- Patent Title: Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit board
- Patent Title (中): 用于印刷电路板，绝缘膜，预浸料和多层印刷电路板的环氧树脂组合物
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Application No.: US13780988Application Date: 2013-02-28
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Publication No.: US08822832B2Publication Date: 2014-09-02
- Inventor: Jin Seok Moon , Seong Hyun Yoo , Keun Yong Lee , Hyun Jun Lee
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2012-0104042 20120919
- Main IPC: H01B3/40
- IPC: H01B3/40 ; H05K1/00 ; C08L63/00 ; C09K19/38 ; C09K19/54 ; B32B27/38
Abstract:
Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.
Public/Granted literature
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