Invention Grant
- Patent Title: Touch sensor assembly and method of making the same
- Patent Title (中): 触摸传感器组件及其制作方法
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Application No.: US13681651Application Date: 2012-11-20
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Publication No.: US08822833B2Publication Date: 2014-09-02
- Inventor: Fan Hsu , Chi-Kuang Lai
- Applicant: Cando Corporation
- Applicant Address: TW Hsin-Chu County
- Assignee: Cando Corporation
- Current Assignee: Cando Corporation
- Current Assignee Address: TW Hsin-Chu County
- Agency: Trop Pruner & Hu, P.C.
- Priority: TW100143365 20111125
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K3/20 ; C23C16/00 ; G06F3/044 ; H05K3/18 ; H05K1/11 ; G06F3/045 ; H05K1/02 ; H05K3/14 ; H05K3/16 ; H05K3/46

Abstract:
A method of making a touch sensor assembly comprises: forming conductive trace elements on a transparent substrate; forming an insulator layer on the transparent substrate such that the insulator layer covers a portion of the conductive trace elements; and forming a plurality of conductive bridging lines such that each of the conductive bridging lines bridges two corresponding ones of the conductive trace elements. Each of the conductive bridging lines includes a plurality of conductor layers stacked one above the other and differing from one another in reflectivity. One of the conductor layers is formed by reacting a reactive gas with a metallic material, and has a reflectivity less than that of the metallic material.
Public/Granted literature
- US20130133935A1 Touch Sensor Assembly and Method of Making the Same Public/Granted day:2013-05-30
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