Invention Grant
- Patent Title: Method for manufacturing honeycomb structure forming die
- Patent Title (中): 制造蜂窝结构成型模具的方法
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Application No.: US13048255Application Date: 2011-03-15
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Publication No.: US08822873B2Publication Date: 2014-09-02
- Inventor: Seiichiro Hayashi , Tomoki Nagae , Masanari Iwade , Hirofumi Hosokawa
- Applicant: Seiichiro Hayashi , Tomoki Nagae , Masanari Iwade , Hirofumi Hosokawa
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2010-065887 20100323
- Main IPC: B23H5/00
- IPC: B23H5/00 ; B23H9/00 ; B23K9/00 ; B23H1/08 ; B23H1/10 ; B23H1/04 ; B23H1/06

Abstract:
A method for manufacturing a honeycomb structure forming die including a liquid groove forming step for forming linear processing liquid grooves whose width is smaller than that of the slit, in positions for forming the slits that form the partition walls of the honeycomb structure by subjecting the kneaded clay to extrusion in one side end face as a kneaded clay forming face of a plate-shaped die substrate. An introduction hole forming step for forming introduction holes for introducing the kneaded clay is performed before or after the liquid groove forming step. Slits communicating with the introduction holes are formed by performing comb-like electro-discharge machining by a comb-like electrode where plate-shaped protrusion electrodes, each corresponding to the width of the slit, are disposed in positions including the processing liquid grooves.
Public/Granted literature
- US20110233171A1 METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE FORMING DIE Public/Granted day:2011-09-29
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