Invention Grant
- Patent Title: Rapid thermal processing systems and methods for treating microelectronic substrates
- Patent Title (中): 用于处理微电子衬底的快速热处理系统和方法
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Application No.: US13868886Application Date: 2013-04-23
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Publication No.: US08822877B2Publication Date: 2014-09-02
- Inventor: Shu Qin
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: B23K10/00
- IPC: B23K10/00
Abstract:
Rapid thermal processing systems and associated methods are disclosed herein. In one embodiment, a method for heating a microelectronic substrate include generating a plasma, applying the generated plasma to a surface of the microelectronic substrate, and raising a temperature of the microelectronic substrate with the generated plasma applied to the surface of the microelectronic substrate. The method further includes continuing to apply the generated plasma until the microelectronic substrate reaches a desired temperature.
Public/Granted literature
- US20130233834A1 RAPID THERMAL PROCESSING SYSTEMS AND METHODS FOR TREATING MICROELECTRONIC SUBSTRATES Public/Granted day:2013-09-12
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