Invention Grant
- Patent Title: Nitride semiconductor ultraviolet light-emitting element
- Patent Title (中): 氮化物半导体紫外线发光元件
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Application No.: US14001342Application Date: 2011-03-23
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Publication No.: US08822976B2Publication Date: 2014-09-02
- Inventor: Tetsuhiko Inazu , Cyril Pernot , Akira Hirano
- Applicant: Tetsuhiko Inazu , Cyril Pernot , Akira Hirano
- Applicant Address: JP Aichi
- Assignee: Soko Kagaku Co., Ltd.
- Current Assignee: Soko Kagaku Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Haynes Beffel & Wolfeld LLP
- International Application: PCT/JP2011/057023 WO 20110323
- International Announcement: WO2012/127660 WO 20120927
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L33/40 ; H01L33/10 ; H01L33/38 ; H01L33/32

Abstract:
A nitride semiconductor ultraviolet light-emitting element is formed by laminating at least an n-type cladding layer configured of an n-type AlGaN semiconductor layer, an active layer including an AlGaN semiconductor layer having band gap energy of 3.4 eV or larger, and a p-type cladding layer configured of a p-type AlGaN semiconductor layer. A p-type contact layer configured of a p-type AlGaN semiconductor layer that absorbs ultraviolet light emitted from the active layer is formed on the p-type cladding layer. The p-type contact layer has an opening portion penetrating through to a surface of the p-type cladding layer. A p-electrode metal layer that makes Ohmic contact or non-rectifying contact with the p-type contact layer is formed on the p-type contact layer so as not to completely block the opening portion. A reflective metal layer for reflecting the ultraviolet light is formed at least on the opening portion and covers the surface of the p-type cladding layer that is exposed through the opening portion either directly or through a transparent insulating layer that allows the ultraviolet light to pass therethrough.
Public/Granted literature
- US20130328013A1 NITRIDE SEMICONDUCTOR ULTRAVIOLET LIGHT-EMITTING ELEMENT Public/Granted day:2013-12-12
Information query
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