Invention Grant
- Patent Title: Amorphous multi-component metallic thin films for electronic devices
- Patent Title (中): 用于电子器件的非晶多组分金属薄膜
-
Application No.: US13868308Application Date: 2013-04-23
-
Publication No.: US08822978B2Publication Date: 2014-09-02
- Inventor: E. William Cowell, III , John F. Wager , Brady J. Gibbons , Douglas A. Keszler
- Applicant: The State of Oregon Acting by and Through the State Board of Higher Education on behalf of Oregon State University
- Applicant Address: US OR Corvallis
- Assignee: The State of Oregon Acting by and through...
- Current Assignee: The State of Oregon Acting by and through...
- Current Assignee Address: US OR Corvallis
- Agent Niels Haun
- Main IPC: H01L29/72
- IPC: H01L29/72 ; H01L29/861 ; H01L29/73 ; H01L29/66 ; H01L29/732
Abstract:
An electronic structure comprising: (a) a first metal layer; (b) a second metal layer; (c) and at least one insulator layer located between the first metal layer and the second metal layer, wherein at least one of the metal layers comprises an amorphous multi-component metallic film. In certain embodiments, the construct is a metal-insulator-metal (MIM) diode.
Public/Granted literature
- US20140191197A1 AMORPHOUS MULTI-COMPONENT METALLIC THIN FILMS FOR ELECTRONIC DEVICES Public/Granted day:2014-07-10
Information query
IPC分类:
