Invention Grant
- Patent Title: Method of repairing probe pads
- Patent Title (中): 修复探针垫的方法
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Application No.: US13615368Application Date: 2012-09-13
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Publication No.: US08822994B2Publication Date: 2014-09-02
- Inventor: John H. Zhang , Laertis Economikos , Robin Van Den Nieuwenhuizen , Wei-Tsu Tseng
- Applicant: John H. Zhang , Laertis Economikos , Robin Van Den Nieuwenhuizen , Wei-Tsu Tseng
- Applicant Address: US TX Coppell US NY Armonk
- Assignee: STMicroelectronics, Inc.,International Business Machines Corporation
- Current Assignee: STMicroelectronics, Inc.,International Business Machines Corporation
- Current Assignee Address: US TX Coppell US NY Armonk
- Agency: Seed IP Law Group PLLC
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L29/10 ; H01L21/66
Abstract:
A method that includes forming a first level of active circuitry on a substrate, forming a first probe pad electrically connected to the first level of active circuitry where the first probe pad having a first surface, contacting the first probe pad with a probe tip that displaces a portion of the first probe pad above the first surface, and performing a chemical mechanical polish on the first probe pad to planarize the portion of the first probe pad above the first surface. The method also includes forming a second level of active circuitry overlying the first probe pad, forming a second probe pad electrically connected to the second level of active circuitry, contacting the second probe pad with a probe tip that displaces a portion of the probe pad, and chemically mechanically polishing the second probe pad to remove the portion displaced.
Public/Granted literature
- US20130063173A1 METHOD OF REPAIRING PROBE PADS Public/Granted day:2013-03-14
Information query
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