Invention Grant
- Patent Title: High linearity bandgap engineered transistor
- Patent Title (中): 高线性带隙工程晶体管
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Application No.: US13211530Application Date: 2011-08-17
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Publication No.: US08823011B2Publication Date: 2014-09-02
- Inventor: Richard T. Chan
- Applicant: Richard T. Chan
- Applicant Address: US NH Nashua
- Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee Address: US NH Nashua
- Agency: Finch & Maloney PLLC
- Agent Neil F. Maloney
- Main IPC: H01L29/12
- IPC: H01L29/12 ; H01L29/786

Abstract:
A high linearity bandgap engineered transistor device is provided. In one example configuration, the device generally includes a substrate and an oxide layer formed on the substrate. The device further includes a wide-bandgap body material formed between a portion of the oxide layer and a gate dielectric layer. The wide-bandgap body material has an energy bandgap of 1.35 eV or higher and is lattice matched to the substrate. The device further includes a source-drain material formed on the oxide layer adjacent to the wide-bandgap body material so as to define a hetero-structure interface where the source-drain material contacts the wide-bandgap body material. The wide-bandgap body material is also lattice matched to the source-drain material. The device further includes a gate material formed over the gate dielectric layer. Other features and variations will be apparent in light of this disclosure.
Public/Granted literature
- US20130043482A1 HIGH LINEARITY BANDGAP ENGINEERED TRANSISTOR Public/Granted day:2013-02-21
Information query
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