Invention Grant
US08823012B2 Enhancement mode GaN HEMT device with gate spacer and method for fabricating the same
有权
具有栅极隔离层的增强型GaN HEMT器件及其制造方法
- Patent Title: Enhancement mode GaN HEMT device with gate spacer and method for fabricating the same
- Patent Title (中): 具有栅极隔离层的增强型GaN HEMT器件及其制造方法
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Application No.: US13403400Application Date: 2012-02-23
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Publication No.: US08823012B2Publication Date: 2014-09-02
- Inventor: Alexander Lidow , Robert Beach , Alana Nakata , Jianjun Cao , Guang Yuan Zhao , Robert Strittmatter , Fang Chang Liu
- Applicant: Alexander Lidow , Robert Beach , Alana Nakata , Jianjun Cao , Guang Yuan Zhao , Robert Strittmatter , Fang Chang Liu
- Applicant Address: US CA El Segundo
- Assignee: Efficient Power Conversion Corporation
- Current Assignee: Efficient Power Conversion Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Dickstein Shapiro LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/02 ; H01L29/20 ; H01L33/00

Abstract:
Enhancement-mode GaN devices having a gate spacer, a gate metal material and a gate compound that are self-aligned, and a methods of forming the same. The materials are patterned and etched using a single photo mask, which reduces manufacturing costs. An interface of the gate spacer and the gate compound has lower leakage than the interface of a dielectric film and the gate compound, thereby reducing gate leakage. In addition, an ohmic contact metal layer is used as a field plate to relieve the electric field at a doped III-V gate compound corner towards the drain contact, which leads to lower gate leakage current and improved gate reliability.
Public/Granted literature
- US20120175631A1 ENHANCEMENT MODE GaN HEMT DEVICE WITH GATE SPACER AND METHOD FOR FABRICATING THE SAME Public/Granted day:2012-07-12
Information query
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