Invention Grant
US08823016B2 Semiconductor light emitting device, nitride semiconductor layer growth substrate, and nitride semiconductor wafer
有权
半导体发光器件,氮化物半导体层生长衬底和氮化物半导体晶片
- Patent Title: Semiconductor light emitting device, nitride semiconductor layer growth substrate, and nitride semiconductor wafer
- Patent Title (中): 半导体发光器件,氮化物半导体层生长衬底和氮化物半导体晶片
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Application No.: US13404553Application Date: 2012-02-24
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Publication No.: US08823016B2Publication Date: 2014-09-02
- Inventor: Toshiki Hikosaka , Yoshiyuki Harada , Maki Sugai , Shinya Nunoue
- Applicant: Toshiki Hikosaka , Yoshiyuki Harada , Maki Sugai , Shinya Nunoue
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-115583 20110524
- Main IPC: H01L29/24
- IPC: H01L29/24 ; H01L33/12 ; H01L33/32 ; H01L29/12 ; C30B29/40 ; H01L33/00

Abstract:
According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer of a first conductivity type and having a major surface, a second semiconductor layer of a second conductivity type, and a light emitting layer provided between the first and second semiconductor layers. The major surface is opposite to the light emitting layer. The first semiconductor layer has structural bodies provided in the major surface. The structural bodies are recess or protrusion. A centroid of a first structural body aligns with a centroid of a second structural body nearest the first structural. hb, rb, and Rb satisfy rb/(2·hb)≦0.7, and rb/Rb
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