Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13579482Application Date: 2011-10-19
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Publication No.: US08823017B2Publication Date: 2014-09-02
- Inventor: Hideto Tamaso
- Applicant: Hideto Tamaso
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; F. Brock Riggs
- Priority: JP2010-245149 20101101
- International Application: PCT/JP2011/073995 WO 20111019
- International Announcement: WO2012/060222 WO 20120510
- Main IPC: H01L29/15
- IPC: H01L29/15

Abstract:
An electrode layer lies on a silicon carbide substrate in contact therewith and has Ni atoms and Si atoms. The number of Ni atoms is not less than 67% of the total number of Ni atoms and Si atoms. A side of the electrode layer at least in contact with the silicon carbide substrate contains a compound of Si and Ni. On a surface side of the electrode layer, C atom concentration is lower than Ni atom concentration. Thus, improvement in electrical conductivity of the electrode layer and suppression of precipitation of C atoms at the surface of the electrode layer can both be achieved.
Public/Granted literature
- US20120319135A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-12-20
Information query
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