Invention Grant
- Patent Title: Semiconductor light emitting device including metal reflecting layer
- Patent Title (中): 半导体发光器件包括金属反射层
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Application No.: US13600145Application Date: 2012-08-30
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Publication No.: US08823031B2Publication Date: 2014-09-02
- Inventor: Takeshi Kususe , Naoki Azuma , Toshiaki Ogawa , Hisashi Kasai
- Applicant: Takeshi Kususe , Naoki Azuma , Toshiaki Ogawa , Hisashi Kasai
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: JP2011-189889 20110831; JP2012-168944 20120730
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/40 ; H01L33/38 ; H01L33/42 ; H01L33/44

Abstract:
A semiconductor light emitting device includes a semiconductor structure, a transparent electrically-conducting layer, a dielectric film, and a metal reflecting layer. The semiconductor structure includes an active region. The transparent electrically-conducting layer is formed on the upper surface of the semiconductor structure. The dielectric film is formed on the upper surface of the transparent electrically-conducting layer. The metal reflecting layer is formed on the upper surface of the dielectric film. The dielectric film has at least one opening whereby partially exposing the transparent electrically-conducting layer. The transparent electrically-conducting layer is electrically connected to the metal reflecting layer through the opening. A barrier layer is partially formed and covers the opening so that the barrier layer is interposed between the transparent electrically-conducting layer and the metal reflecting layer.
Public/Granted literature
- US20130049053A1 SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING METAL REFLECTING LAYER Public/Granted day:2013-02-28
Information query
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